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KM6264B Family
8Kx8 bit Low Power CMOS Static RAM FEATURE SUMMARY
* Process Technology : CMOS * Organization : 8K x 8 * Power Supply Voltage : Single 5V 10% * Low Data Retention Voltage : 2V(Min) * Three state output and TTL Compatible * Package Type : JEDEC Standard 28-DIP, 28-SOP
CMOS SRAM
GENERAL DESCRIPTION
The KM6264B family is fabricated by SAMSUNG's advanced CMOS process technology. The family can support various operating temperature ranges and has various package types for user flexibility of system design. The family also support low data retention voltage for battery back-up operations with low data retention current.
PRODUCT FAMILY
Product Family KM6264BL KM6264BL-L KM6264BLE KM6264BLE-L KM6264BLI KM6264BLI-L Operating Temperature Commercial (0~70 C) Extended (-25~-85 C) Industrial (-40~85 C) Speed PKG Type Power Dissipation Standby(Isb1, Max) Operating(Icc2) 100uA 70/100/120ns 28-DIP, 28-SOP 100*ns 100*ns 28-SOP 28-SOP 10uA 100uA 50uA 100uA 50uA 55mA
* measured with 30pF test load
PIN DESCRIPTION
N.C A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 Vss 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 Vcc /WE
FUNCTIONAL BLOCK DIAGRAM
Y-Decoder X-Decoder Control Logic
CS2 A8 A9 A11 /OE A10 /CS1 I/O8 I/O7 I/O6 I/O5 I/O4
Cell Array
A0~A12
28-Pin DIP 28-Pin SOP
22 21 20 19 18 17 16 15
I/O1~8
I/O Buffer Function
/CS1, CS2 /WE, /OE
Pin Name A0~A12 /WE /CS1, CS2 /OE I/O1~I/O8 Vcc Vss N.C
Address Inputs Write Enable Input Chip Select Input Output Enable Input Data Input/Output Power(5V) Ground No Connection
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Revision. 0.0 Auust. 1996
KM6264B Family
PRODUCT LIST & ORDERING INFORMATION
PRODUCT LIST
Commercial Temp Products (0~70 C) Part Name
KM6264BLP-7 KM6264BLP-7L KM6264BLP-10 KM6264BLP-10L KM6264BLP-12 KM6264BLP-12L KM6264BLG-7 KM6264BLG-7L KM6264BLG-10 KM6264BLG-10L KM6264BLG-12 KM6264BLG-12L
CMOS SRAM
Extended Temp Products (-25~85 C) Part Name
KM6264BLGE-10 KM6264BLGE-10L
Industrial Temp Products (-40~85 C) Part Name
KM6264BLGI-10 KM6264BLGI-10L
Function
28-DIP, 70ns, L-pwr 28-DIP, 70ns, , LL-pwr 28-DIP, 100ns, , L-pwr 28-DIP, 100ns, LL-pwr 28-DIP, 120ns, , L-pwr 28-DIP, 120ns, LL-pwr 28-SOP, 70ns, L-pwr 28-SOP, 70ns, LL-pwr 28-SOP, 100ns, L-pwr 28-SOP, 100ns, LL-pwr 28-SOP, 120ns, L-pwr 28-SOP, 120ns, LL-pwr
Function
28-SOP, 100ns, L-pwr 28-SOP, 100ns, LL-pwr
Function
28-SOP, 100ns, L-pwr 28-SOP, 100ns, LL-pwr
ORDERING INFORMATION K M6 2 X 64 B X X XX XX X
L-Low Low Power, Blank-Low Power or High Power Access Time : 7=70ns, 10=100ns, 12=120ns Operating Temperature : I=Industrial, E=Extended, Blank=Commercial Package Type : G=SOP, P=DIP, L-Low Power or Low Low Power, Blank-High Power Die Version : B=3rd generation Density : 64=64K bit Blank=5V Organization : 2= x8 SEC Standard SRAM
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KM6264B Family
ABSOLUTE MAXIMUM RATINGS *
Item Voltage on any pin relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Storage temperature Operating Temperature Symbol Vin, Vout Vcc Pd Tstg Ta Ratings -0.5 to Vcc+0.5 -0.5 to 7.0 1.0 -65 to 150 0 to 70 -25 to 85 -40 to 85 Soldering temperature and time Tsolder 260 C, 10sec(Lead Only) Unit V V W C C C C -
CMOS SRAM
Remark KM6264BL/L-L KM6264BLE/LE-L KM6264BLI/LI-L -
* Stresses greater than those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS*
Item Supply voltage Ground Input high voltage Input low voltage Symbol Vcc Vss Vih Vil Min 4.5 0 2.2 -0.5*** Typ** 5.0 0 Max 5.5 0 Vcc+0.5 0.8 Unit V V V V
* 1) Commercial Product : Ta=0 to 70 C, unless otherwise specified 2) Extended Product : Ta=-25 to 85 C, unless otherwise specified 3) Industrial Product : Ta=-40 to 85 C, unless otherwise specified ** Ta=25 C *** Vil(min)=-3.0V for A 0ns pulse 5
CAPACITANCE * (f=1MHz, Ta=25 C)
Item Input capacitance Input/Output capacitance Symbol Cin Cio Test Condition Vin=0V Vio=0V Min Max 6 8 Unit pF pF
* Capacitance is sampled not 100% tested
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KM6264B Family
DC AND OPERATING CHARACTERISTICS
Item Input leakage current Output leakage current Operating power supply current Average operating current Symbol Ili Ilo Icc Icc1 Test Conditions* Vin=Vss to Vcc /CS1=Vih or CS2=Vil or /WE=Vil Vi/o=Vss to Vcc /CS1=Vil, CS2=Vih Vin=Vil or Vih, Ii/o=0mA Cycle time=1us, 100% duty /CS1 A .2V, CS2 A cc-0.2V 0 V Icc2 Output low voltage Output high voltage Standby Current(TTL) Standby Current (CMOS) KM6264BL KM6264BL-L KM6264BLE KM6264BLE-L KM6264BLI KM6264BLI-L
* 1) Commercial Product : Ta=0 to 70 C, Vcc=5V+/-10%, unless otherwise specified 2) Extended Product : Ta=-25 to 85 C, Vcc=5V+/-10%, unless otherwise specified 3) Industrial Product : Ta=-40 to 85 C, Vcc=5V+/-10%, unless otherwise specified ** Ta=25 C
CMOS SRAM
Min -1 -1 -
Typ** 7 -
Max 1 1 15 10
Unit uA uA mA mA
Min cycle, 100% duty /CS1=Vil, CS2=Vih, Ii/o=0mA Iol=2.1mA Ioh= -1.0mA /CS1=Vih or CS2=Vil /CS1 A cc-0.2V V CS2 A cc-0.2V or V CS2 A .2V 0 Others 0~Vcc L LL L LL L LL
2.4 -
2 1 -
55 0.4 1 100 10 100 50 100 50
mA V V mA uA uA uA uA uA uA
Vol Voh Isb Isb1
A.C CHARACTERISTICS
TEST CONDITIONS(1. Test Load and Test Input/Output Reference)*
Item Input pulse level Input rise fall time Value 0.8 to 2.4V 5ns Remark * Including scope and jig capacitance * See test condition of DC and AC Operating characteristics
CL*
Input and output reference voltage 1.5V Output load(See right) CL=100pF+1TTL
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KM6264B Family
TEST CONDITIONS(2. Temperature and Vcc Conditions)
Product Family KM6264BL/L-L KM6264BLE/LE-L KM6264BLI/LI-L
* measured with 30pF test load
CMOS SRAM
Temperature 0~70 C -25~85 C -40~85 C
Power Supply(Vcc) 5V +/- 10% 5V +/- 10% 5V +/- 10%
Speed Bin 70/100/120ns 100*ns 100*ns
Comments Commercial Extended Industrial
PARAMETER LIST FOR EACH SPEED BIN
Speed Bins Parameter List Read Read cycle time Address access time Chip select to output Output enable to valid output Chip select to low-Z output Output enable to low-Z output Chip disable to high-Z output Output disable to high-Z output Symbol 70 5 5 0 0 10 70 60 0 60 40 0 0 30 0 5 70ns Min tRC tAA tCO tOE tLZ tOLZ tHZ Max 70 70 35 30 30 30 100ns Min 100 10 5 0 0 10 100 80 0 80 60 0 0 40 0 5 Max 100 100 50 35 35 30 120ns Min 120 10 5 0 0 10 120 85 0 85 70 0 0 50 0 10 Max 120 120 60 40 40 30 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Units
tOHZ Output hold from address change tOH Write Write cycle time tWC Chip select to end of write tCW Address set-up time Address valid to end of write Write pulse width Write recovery time Write to output high-Z Data to write time overlap Data hold from write time End write to output low-Z tAS tAW tWP tWR tWHZ tDW tDH tOW
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ELECTRONICS
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KM6264B Family
DATA RETENTION CHARACTERISTICS
Item Vcc for data retention Data retention current Vdr Idr KM6264BL KM6264BL-L KM6264BLE KM6264BLE-L KM6264BLI KM6264BLI-L Data retention set-up time tSDR Recovery time tRDR waveform Symbol Test Condition* /CS*** A cc-0.2V V L-Ver Vcc=3.0V /CS A cc-0.2V V LL-Ver L-Ver LL-Ver L-Ver LL-Ver See data retention Min 2.0 0 5
CMOS SRAM
Typ** Max Unit 1 0.5 5.5 50 5 50 25 50 25 ms uA V
* 1) Commercial Product : Ta=0 to 70 C, unless otherwise specified 2) Extended Product : Ta=-25 to 85 C, unless otherwise specified 3) Industrial Product : Ta=-40 to 85 C, unless otherwise specified ** Ta=25 C *** /CS1 A cc-0.2, CS2 A cc-0.2(/CS1 Controlled) or CS2 A .2(CS2 Controlled) V V 0
DATA RETENTION TIMING DIAGRAM
1) /CS1 controlled
Vcc 4.5V
tSDR
Data retention mode
tRDR
2.2V Vdr
/CS1 GND
/CS1 A cc-0.2V V
2) CS2 controlled
Vcc 4.5V
tSDR
Data retention mode
tRDR
CS2 Vdr
CS2 A.2V 0
0.4V GND
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Revision. 0.0 Auust. 1996
KM6264B Family
TIMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE (1)
(/CS=/OE=Vil, CS2=/WE=Vih)
tRC Address tAA tOH Data Out Previous Data Valid Data Valid (Address Controlled)
CMOS SRAM
TIMING WAVEFORM OF READ CYCLE(2)
(/WE= VIH) t RC
Address tAA tCO1 /CS1 tOH
CS2 tCO2 tHZ(1,2) tHZ tOE /OE tOLZ t LZ Data out High - Z Data Vailid tOHZ
Notes(Read Cycle) 1. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels. 2. At any given temperature and voltage condition, tHZ(Max) is less than tLZ(Min) both for a given device and device to device interconnection.
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Revision. 0.0 Auust. 1996
KM6264B Family
TIMING WAVEFORM OF WRITE CYCLE(1)
Address tCW(2) /CS tAW CS2 tCW(2) tWP(1) /WE tAS Data in tWHZ Data out Data Undefined tDW Data Vailid tOW tDH (/WE Controlled) tWC
CMOS SRAM
tWR1(4)
TIMING WAVEFORM OF WRITE CYCLE(2)
(/CS1 Controlled) tWC
Address tAS /CS1 tAW tCW(2) tWR1(4)
CS2 tCO2 tWP(1) /WE tDW Data in Data Vailid t DH
Data out
High - Z
High - Z
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Revision. 0.0 Auust. 1996
KM6264B Family
TIMING WAVEFORM OF WRITE CYCLE(3)
(CS2 Controlled) tWC Address tAS(3) /CS1 tAW CS2 tCW(2) tWP(1) /WE tDW Data in Data Vailid t DH tCW(2)
CMOS SRAM
tWR2(4)
Data out
High - Z
High - Z
Notes(Write Cycle) 1. A write occurs during the overlap of a low /CS1, a high CS2 and a low /WE. A write begins at the latest transition among /CS1 going low, CS2 going high and /WE going low. A write ends at the earliest transition among /CS1 going high, CS2 going low and /WE going high, tWP is measured from the beginning of write to the end of write. 2. tCW is measured from the later of /CS1 going low or CS2 going high to the end of write. 3. tAS is measured from the address valid to the beginning of write. 4. tWR is measured from the end of write to the address change. tWR1 applied in case a write ends at /CS1, or /WE going high, tWR2 applied in case a write ends at CS2 going to low.
FUNCTIONAL DESCRIPTION
/CS1 H X L L L CS2 X L H H H /WE X X H H L /OE X X H L X Mode Power Down Power Down Output Disable Read Write I/O Pin High-Z High-Z High-Z Dout Din Current Mode Isb, Isb1 Isb, Isb1 Icc Icc Icc
* X means don't care
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ELECTRONICS
Revision. 0.0 Auust. 1996
KM6264B Family
PACKAGE DIMENSION
28 PIN PLASTIC SMALL OUTLINE PACKAGE
#28 #15
CMOS SRAM
Unit : Millimeters (Inches)
(450mil ) 0 ~ 8
1.02 0.20 0.040 0.008
8.38 0.20 0.330 0.008
11.81 0.30 0.465 0.012
#1
#14
18.69 MAX 0.736 18.29 0.20 0.720 0.008
1.27 0.050 2.59 0.20 0.102 0.008 3.00 MAX 0.118 0.05 MIN 0.002
0.10 MAX 0.004
0.15 0.006
+ 0.10 - 0.05 + 0.004 - 0.002
0.89 0.035
0.41 0.10 0.016 0.004
28 PIN PLASTIC DUAL INLINE PACKAGE
36.72 MAX 1.446
#28
(600mil)
#15
0 ~ 15
13.60 0.20 0.535 0.008
15.24 0.600
#1
#14
36.32 0.20 1.430 0.008
3.81 0.20 0.150 0.008 5.08 MAX 0.200 3.30 0.30 0.130 0.012
0.25 - 0.05
+ 0.10 + 0.004
0.010 - 0.002
1.65 0.065
2.54 0.100
0.46 0.10 0.018 0.004 1.52 0.10 0.060 0.004 10
0.38 MIN 0.015
Revision. 0.0 Auust. 1996
ELECTRONICS

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